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    • 1. 发明专利
    • Press contact type semiconductor device
    • 新闻联系型半导体器件
    • JP2012244076A
    • 2012-12-10
    • JP2011115248
    • 2011-05-23
    • Honda Motor Co Ltd本田技研工業株式会社
    • SHIBA KEISUKEWATANABE SHOHEI
    • H01L21/52H01L23/28
    • H01L24/33
    • PROBLEM TO BE SOLVED: To provide a press contact type semiconductor device capable of suppressing contamination and warp of a semiconductor element.SOLUTION: A press contact type semiconductor device 1 is formed by pressurizing and holding, by a pair of electrode plates 3 and 3, a semiconductor element 2 including a semiconductor substrate 4, a first emitter electrode layer 51 and a second emitter electrode layer 52 laminated on a front surface side of the semiconductor substrate 4, and a first collector electrode layer 61 and a second collector electrode layer 62 laminated on a back surface side of the semiconductor substrate 4. The first emitter electrode layer 51 and the second emitter electrode layer 52 are formed respectively into a prescribed pattern shape, the first collector electrode layer 61 covers the entire back surface of the semiconductor substrate 4, and an outer peripheral end part 62a of the second collector electrode layer 62 roughly matches with an outer peripheral end part 52a of the second emitter electrode layer 52 in a projection view in a pressurizing direction T by the pair of electrode plates 3 and 3.
    • 解决的问题:提供能够抑制半导体元件的污染和翘曲的压接式半导体器件。 解决方案:通过一对电极板3和3加压并保持包括半导体衬底4,第一发射极电极层51和第二发射极电极的半导体元件2,形成压接式半导体器件1 层叠在半导体基板4的表面侧的层52以及层叠在半导体基板4的背面侧的第一集电电极层61和第二集电极层62.第一发射极电极层51和第二发射极 电极层52分别形成为规定的图案形状,第一集电电极层61覆盖半导体基板4的整个背面,第二集电极层62的外周端部62a与外周端 第二发射极电极层52的部分52a在一对电极板3和3的加压方向T的投影视图中。 版权所有(C)2013,JPO&INPIT
    • 3. 发明专利
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2011249438A
    • 2011-12-08
    • JP2010118970
    • 2010-05-25
    • Honda Motor Co Ltd本田技研工業株式会社
    • SHIBA KEISUKESATO SHINNOSUKE
    • H01L29/739H01L21/28H01L21/336H01L21/52H01L29/06H01L29/417H01L29/423H01L29/49H01L29/78
    • H01L24/27H01L24/83H01L24/95H01L2224/83192H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which an emitter and a gate finger electrode having a desired thickness can be formed without requiring exact control of etching thickness in the etching of a pressure-contact IGBT having an emitter and a gate finger electrode consisting of an extremely thin metal film.SOLUTION: The method for manufacturing a semiconductor device used in a pressure-contact semiconductor includes: a step for forming a first Al layer on an Si substrate; a step for etching a part of the first Al layer so that an emitter electrode and a gate finger electrode having a desired shape can be obtained; a step for forming an underlying layer consisting of a metal other than Al on the first Al layer; a step for forming a second Al layer on the underlying layer; a step for coating a part of the second Al layer corresponding to the emitter electrode with resist; a step for etching the second Al layer other than the part coated with resist; a step for etching the underlying layer other than the part coated with resist; and a step for removing the resist.
    • 解决的问题:提供一种制造半导体器件的方法,其中可以形成具有期望厚度的发射极和栅极指电极,而不需要精确地控制蚀刻厚度的压接触点IGBT, 由极薄的金属膜构成的发射极和栅极指状电极。 解决方案:用于制造用于压接半导体的半导体器件的方法包括:在Si衬底上形成第一Al层的步骤; 用于蚀刻第一Al层的一部分以便可以获得具有期望形状的发射极和栅极指电极的步骤; 在第一Al层上形成由Al以外的金属构成的下层的工序; 在下层上形成第二Al层的步骤; 用抗蚀剂涂覆对应于发射极的第二Al层的一部分的步骤; 用于蚀刻除了涂覆有抗蚀剂的部分之外的第二Al层的步骤; 用于蚀刻除了涂覆有抗蚀剂的部分之外的下层的步骤; 以及去除抗蚀剂的步骤。 版权所有(C)2012,JPO&INPIT